(Mobile book) Silicon Wafer Bonding Technology for VLSI and MEMS Applications (Emis Processing Series, 1)






 | #3188130 in Books |  2002-05-15 | Original language:English | PDF # 1 |  10.00 x7.50 x.75l,.0 | File Name: 0852960395 | 200 pages

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The use of silicon-on-insulator (SOI) technology in microelectronics is proliferating and is ready to be applied in a growing number of IC fabrication situations. Bonding of single crystal Si to dielectrics, normally silicon dioxide, is a key method of producing SOI structures and this work is designed to assist engineers directly in applying emerging SOI technology in practice. Wafer bonding principles, grind and polish back, Smartcut, Eltran and wafer characterization...


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