[FREE] Pulsed and Pulsed Bias Sputtering: Principles and Applications
| #5436159 in Books | Springer | 2003-09-30 | Original language:English | PDF # 1 | 9.21 x.44 x6.14l,.95 | File Name: 140207543X | 157 pages |
||1 of 1 people found the following review helpful.| piezoelectric and metallic of great interest to extend processing to the THz and memory ...|By Ernesto Valapotenciaminoacid|Some theory on plasma sheaths but no information on what this has to do with thin film processing or deposited film qualities. Fortunatly there are monographs that tell you why someone might want to combine these plasma processes and the range of physical
Diffusion Barrier Stack - 5 nm -3 nm -2 nm :. . . -. . . . : . . O. 21-lm Figure 2: Schematic representing a cross-sectional view of the topography that is encountered in the processing of integrated circuits. (Not to scale) these sub-micron sized features is depicted in Fig. 2. The role of the diffusion barrier is to prevent the diffusion of metallic ions into the interlayer dielectric (lLD). Depending on the technology, in particular the choice of the ILD and the meta...
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